- July 12, 2021
- Posted by: Stratford Team
- Category: Business
SANTA CLARA, Calif.–(BUSINESS WIRE)–Intel is accelerating its annual cadence of innovation with new advancements in semiconductor process and packaging as part of its IDM 2.0 strategy.
Join a webcast with CEO Pat Gelsinger and Dr. Ann Kelleher, senior vice president and general manager of Technology Development, where they will provide a deeper look at Intel’s process and packaging roadmaps.
When: 2 p.m. PDT, Monday, July 26
Where: Watch live on the Intel Newsroom.
Event Replay: A video replay will be available on the Intel Newsroom following the webcast.
Updates: To receive updates on the news, visit the Intel Newsroom and follow along on Twitter with @IntelNews.
More: Process & Packaging Innovations (Press Kit)
Intel (Nasdaq: INTC) is an industry leader, creating world-changing technology that enables global progress and enriches lives. Inspired by Moore’s Law, we continuously work to advance the design and…